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| (R) STPS1545D/F/FP/R/G POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) 15 A 45 V 175 C 0.57 V A K A K FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING INSULATED PACKAGE: ISOWATT220AC, TO-220FPAC Insulating voltage = 2000V DC Capacitance = 12pF AVALANCHE CAPABILITY SPECIFIED s s s s s TO-220AC STPS1545D TO-220FPAC STPS1545FP A K A A K DESCRIPTION Single chip Schottky rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. Packaged in TO-220AC, ISOWATT220AC, TO-220FPAC, I2PAK or D2PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) RMS forward current Average forward current = 0.5 Parameter Repetitive peak reverse voltage I2PAK STPS1545R K ISOWATT220AC STPS1545F A NC D2PAK STPS1545G Value 45 30 Unit V A A TO-220AC, I2PAK, D2PAK ISOWATT220AC TO-220FPAC Tc = 155C Tc = 130C 15 IFSM IRRM IRSM PARM Tstg Tj dV/dt *: Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range tp = 10 ms Sinusoidal tp = 2 s square F = 1kHz tp = 100 s square tp = 1s Tj = 25C 220 1 3 6000 - 65 to + 175 175 10000 A A A W C C V/s Maximum operating junction temperature * Critical rate of rise of reverse voltage dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a ) 1/7 July 2003 - Ed: 5F STPS1545D/F/FP/R/G THERMAL RESISTANCES Symbol Rth (j-c) Junction to case Parameter TO-220AC, I PAK, D2PAK ISOWATT220AC TO-220FPAC STATIC ELECTRICAL CHARACTERISTICS Symbol IR * VF * Parameter Reverse leakage current Forward voltage drop Tests Conditions Tj = 25C Tj = 125C Tj = 125C Tj = 25C Tj = 125C Pulse test : * tp = 380 s, < 2% 2 Value 1.6 4.0 Unit C/W Min. Typ. 11 Max. 200 40 0.57 0.84 0.72 Unit A mA V VR = VRRM IF = 15 A IF = 30 A IF = 30 A 0.65 0.5 To evaluate the conduction losses use the following equation : P = 0.42 x IF(AV) + 0.01 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. PF(av)(W) 12 10 8 6 4 2 IF(av) (A) 0 0 2 4 6 8 10 12 =tp/T tp T Fig. 2: Average current temperature ( = 0.5). IF(av)(A) versus ambient = 0.1 = 0.05 = 0.2 = 0.5 =1 14 16 18 18 16 14 12 10 8 6 4 2 0 Rth(j-a)=Rth(j-c) TO-220AC ISOWATT220AC Rth(j-a)=15C/W T =tp/T tp Tamb(C) 50 75 100 125 150 175 0 25 Fig. 3: Normalized avalanche power derating versus pulse duration. PARM(tp) PARM(1s) 1 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(25C) 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(s) 10 100 1000 Tj(C) 0 0 25 50 75 100 125 150 2/7 STPS1545D/F/FP/R/G Fig. 5-1: Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220AC, I2PAK and D2PAK). IM(A) 200 180 160 140 120 100 80 60 IM 40 20 0 1E-3 Fig. 5-2: Non repetitive surge peak forward current versus overload duration (maximum values) (ISOWATT220AC, TO-220FPAC). IM(A) 120 100 80 Tc=75C Tc=100C Tc=125C 60 40 IM Tc=75C Tc=100C Tc=125C t 20 t(s) 1E-2 1E-1 1E+0 t =0.5 =0.5 t(s) 1E-2 1E-1 1E+0 0 1E-3 Fig. 6-1: Relative variation of thermal transient impedance junction to case versus pulse duration (TO-220AC, I2PAK and D2PAK). Zth(j-c)/Rth(j-c) 1.0 0.8 0.6 0.4 T = 0.5 Fig. 6-2: Relative variation of thermal transient impedance junction to case versus pulse duration (ISOWATT220AC, TO-220FPAC). Zth(j-c)/Rth(j-c) 1.0 0.8 0.6 0.4 = 0.5 0.2 = 0.2 = 0.1 Single pulse 0.2 tp(s) 1E-2 =tp/T tp = 0.2 = 0.1 Single pulse T tp(s) 1E-1 0.0 1E-4 1E-3 1E-1 1E+0 0.0 1E-3 =tp/T tp 1E-2 1E+0 1E+1 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). IR(A) 5E+4 Tj=150C Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(pF) 2000 F=1MHz Tj=25C 1E+4 1E+3 Tj=125C 1000 Tj=100C Tj=75C 500 1E+2 1E+1 1E+0 Tj=50C Tj=25C 200 VR(V) 30 35 40 45 VR(V) 0 5 10 15 20 25 100 1 2 5 10 20 50 3/7 STPS1545D/F/FP/R/G Fig. 9: Forward voltage drop versus forward current (maximum values). IFM(A) 100.0 Typical values Tj=125C Tj=25C Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board FR4, Cu=35m) (D2PAK). 80 70 60 50 40 30 20 10 Rth(j-a) (C/W) 10.0 Tj=125C 1.0 VFM(V) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 S(Cu) (cm) 0 5 10 15 20 25 30 35 40 PACKAGE MECHANICAL DATA TO-220FPAC REF. DIMENSIONS Millimeters A H B Inches Min. Max. 0.173 0.181 0.098 0.106 0.098 0.108 0.018 0.027 0.030 0.039 0.045 0.067 0.195 0.205 0.094 0.106 0.393 0.409 0.63 Typ. 1.126 1.205 0.386 0.417 0.114 0.142 0.626 0.646 0.354 0.366 0.118 0.126 Dia L6 L2 L3 L5 D F1 L4 L7 F G1 G E A B D E F F1 G G1 H L2 L3 L4 L5 L6 L7 Dia. Min. Max. 4.4 4.6 2.5 2.7 2.5 2.75 0.45 0.70 0.75 1 1.15 1.70 4.95 5.20 2.4 2.7 10 10.4 16 Typ. 28.6 30.6 9.8 10.6 2.9 3.6 15.9 16.4 9.00 9.30 3.00 3.20 4/7 STPS1545D/F/FP/R/G PACKAGE MECHANICAL DATA ISOWATT220AC A H B DIMENSIONS REF. A B D L7 Millimeters Min. Typ. Max. 4.60 2.70 2.75 0.70 1.00 1.70 5.20 16.00 28.60 15.90 9.00 3.00 30.60 1.125 16.40 0.626 9.30 3.20 0.354 0.118 Min. 0.173 0.098 0.094 0.016 0.030 0.045 0.195 4.40 2.50 2.40 0.40 0.75 1.15 4.95 10.00 Inches Typ. Max. 0.181 0.106 0.108 0.028 0.039 0.067 0.205 0.409 0.630 1.205 0.646 0.366 0.126 L6 L2 L3 Diam E F F1 G H L2 L3 L6 F1 10.40 0.394 F G D E L7 Diam PACKAGE MECHANICAL DATA IPAK REF. Min. A E L2 c2 DIMENSIONS Millimeters Max. 4.60 2.69 0.93 1.17 1.17 0.60 1.36 9.35 2.70 10.4 13.6 3.78 1.40 Inches Min. 0.173 0.098 0.028 0.044 0.044 0.018 0.048 0.352 0.094 0.394 0.516 0.137 0.050 Max. 0.181 0.106 0.037 0.046 0.046 0.024 0.054 0.368 0.106 0.409 0.535 0.149 0.055 A A1 b b1 b2 c c2 4.40 2.49 0.70 1.14 1.14 0.45 1.23 8.95 2.40 10.0 13.1 3.48 1.27 D L1 b2 L b1 b e A1 D e E L c L1 L2 5/7 STPS1545D/F/FP/R/G PACKAGE MECHANICAL DATA D2PAK REF. A E L2 C2 DIMENSIONS Millimeters Min. Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 A A1 D 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A2 B B2 C L L3 A1 B2 B G A2 C R C2 D E G L M * V2 L2 L3 M R * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0.016 typ. FOOT PRINT DIMENSIONS (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 6/7 STPS1545D/F/FP/R/G PACKAGE MECHANICAL DATA TO-220AC REF. H2 C L5 OI L6 L2 D L7 A L9 F1 L4 F G M E A C D E F F1 G H2 L2 L4 L5 L6 L7 L9 M Diam. I DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 10.00 10.40 0.393 0.409 16.40 typ. 0.645 typ. 13.00 14.00 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151 Type STPS1545D STPS1545F STPS1545FP STPS1545R STPS1545G STPS1545G-TR s s s s Marking STPS1545D STPS1545F STPS1545FP STPS1545R STPS1545G STPS1545G Package TO-220AC ISOWATT220AC TO-220FPAC I2PAK D PAK D PAK 2 2 Weight 1.86 g 2.0 g 1.9 g 1.7 g 1.48 g 1.48 g Base qty 50 50 50 50 50 1000 Delivery mode Tube Tube Tube Tube Tube Tape & Reel Cooling method: by conduction (C) Recommended torque value: 0.55 N.m. Maximum torque value: 0.7 N.m. Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 7/7 |
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